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Project_2 : Chip damage assessment for the mobile phone drop
In this example, we will estimate the chip damage of mobile phone during the drop. The following picture shows typical chips layout.
CPU chip located in the middle of PCB and several screws used to fix the board with mobile phone case. We will model the chip as a simple element and plot the chip acceleration under the drop conditions to evaluate the chip damage and the below picture shows time history view during the mobile phone drop.
We see the five screw fixation conditions shows max. chip acceleration 5.55 m/s^2, and the three screw fixation condition 7.39 m/s^2 which is 33.1 % larger max. acceleration than the fixation with five screw.
The above calculation done with Impact FEM software which is developed under the terms of GNU free license.
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